for Papers.]
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CALL FOR PAPERS
International Conference on Embedded Wireless Systems and
Networks (EWSN)
In-cooperation with ACM SIGBED and ACM SIGMOBILE
February 17-19, 2020 - Lyon, France
https://ewsn2020.conf.citi-lab.fr/
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IMPORTANT DATES
Paper registration: September 28, 2019
Paper submission: September 28, 2019
Authors rebuttal deadline: November 15, 2019
Notification: November 29, 2019
Each deadline is 23:59 UTC-12 (AoE).
SCOPE
The International Conference on Embedded Wireless Systems and Networks
(EWSN) is a highly selective single-track international conference
focusing on the latest research results on embedded systems and wireless
networking, key enablers for visionary scenarios such as the Internet of
Things and Cyber-Physical Systems. After last year's positive experience
in China, the 17th edition returns to Europe in Lyon, France. The
conference continues its aim for broad, world-wide impact.
TOPICS OF INTEREST
The conference solicits both full technical papers and short papers
describing validated early ideas. Specific topics of interest include
but are not limited to:
- Communication and networking for wireless and embedded systems
- Sensing, actuation, and control
- Operating systems, middleware, and services
- Processing, storage, and management of data
- Programming paradigms, languages, and tools
- Time and location management
- Dependability (real-time, reliability, availability, safety)
- Privacy and security in applications and systems
- Human-machine interaction with wireless and embedded systems
- Design and implementation of real-world applications and systems
- Measurement studies and deployment experiences
- Green IoT (low-power, harvesting, energy management)
- Challenges of ultra dense networks
- Heterogeneous networks
- Applications and problems from developing countries and emerging markets
As always, contributions are welcome across the entire scope of the
conference. As the relevant environments grow increasingly diverse and
dense, we encourage contributions addressing this increased
heterogeneity, and ultra dense networks. Papers highlighting novel ideas
that are not ready for extensive evaluations, report on new tools and
platforms with limited evaluation, or topics that could be adequately
described in a short format are invited for submission as short papers.
Initial explorations of profound problems in developing countries that
have been addressed using IoT solutions may also be appropriate short
paper submissions.
The conference proceedings will appear in the ACM Digital Library.
Selected accepted papers will be fast-tracked to ACM Transactions on
Sensor Networks (TOSN) or ACM Transactions on the Internet of Things (TIOT).
SUBMISSION
Submissions to EWSN 2020 must be original (i.e., not previously
published) and not currently under review by any other conference or
journal. EWSN 2020 will adopt a double-blind review process. Authors
must make a good faith effort to anonymize their submissions to ensure
that their identities are not disclosed to reviewers and reviewers are
discouraged from actively working to uncover author identities. To
promote early dissemination, submission to arXiv (or similar) is
allowed, provided cross-citations are not made.
Formatting requirements. Both full (10-12 pages) and short papers (4-6
pages) are welcome. Authors should carefully consider this choice as
full papers will not be considered as short paper candidates during the
review phase. Pages must use 8.5" x 11" (letter) two-column format,
using 10-point type on 11-point leading, with a maximum text block of 7"
wide x 9" deep with an inter-column spacing of .25". The page limits
include figures, tables, and references. Authors may use the LaTex
templates provided here.
Paper Submission. Paper submission is managed through HotCRP at the
following site: http://hotcrp-ewsn2020.citi-lab.fr
TPC (preliminary)
Omprakash Gnawali, University of Houston (USA) (chair)
Amy L. Murphy, Fondazione Bruno Kessler (Italy) (chair)
Olivier Berder, IRISA (France)
Carlo Alberto Boano, Graz University of Technology (Austria)
Maurizio Bocca, BYTON (USA)
Philippe Bonnet, IT University of Copenhagen (Denmark)
Matteo (Ceriotti) Zella, U of Duisburg-Essen (Germany)
Mun Choon Chan, NUS (Singapore)
Jiming Chen, ZJU (China)
Octav Chipara, University of Iowa (USA)
Wei Dong, ZJU (China)
Andrzej Duda, LIG, UGA (France)
Xenofon Fafoutis, Technical University of Denmark (Denmark)
Luoyi Fu, SJTU (China)
Jie Gao, Stony Brook University (USA)
Vlado Handziski, TU Berlin (Germany)
Yuan He, Tsinghua University (China)
Oana Iova, INSA Lyon (France)
Konrad Iwanicki, University of Warsaw (Poland)
Salil Kanhere, UNSW (Australia)
Rudiger Kapitza, TU Braunschweig (Germany)
Olaf Landsiedel, Kiel University (Germany) and Chalmers University (Sweden)
Andrew Markham, U of Oxford (UK)
Julie McCann, Imperial College (UK)
Luca Mottola, Politecnico di Milano (Italy) and SICS (Sweden)
Thomas Noel, Université Strasbourg (France)
Chiara Petrioli, U of Rome, La Sapienza (Italy)
Gian Pietro Picco, University of Trento (Italy)
Andreas Reinhardt, Technische Universität Clausthal (Germany)
Utz Roedig, University College Cork (Ireland)
Kay Römer, TU Graz (Austria)
Olga Saukh, TU Graz (Austria)
Leo Selavo, U of Latvia (Latvia)
Longfei Shangguan, Microsoft Research (USA)
Philipp Sommer, ABB (Switzerland)
Junehwa Song, KAIST (Korea)
Cormac Sreenan, U of Cork (Ireland)
Eduardo Tovar, U of Porto (Portugal)
Xiaolong Zheng, Beijing University of Posts and Telecommunications (China)
Yuanqing Zheng, PolyU HK (China)
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