Thursday, March 12, 2020

[DMANET] IEEE SMARTCOMP 2020 - joint call for co-located events

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IEEE SMARTCOMP 2020
Call for Papers
22-24 June 2020, Bologna, Italy
http://www.smart-comp.org
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COVID-19 UPDATE:
The committee is aware of the COVID-19 situation and considering all the alternative options. We are considering to permit remote participation/presentation to the conference, postponing the conference to the autumn or moving the conference to another location, in case unsafe travel conditions to Italy still persist.

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JOINT CALL FOR CO-LOCATED EVENTS

IEEE SMARTCOMP is offering an exciting program of co-located events, including
- 5 high-quality workshops
- 1 Industry track
- 1 PhD Forum
- 1 WIP & Demo

Below we provide the key features of each event.
For additional information, please refer to the conference website
http://www.smart-comp.org
and to the websites of the individual events listed below.

All submissions are handled through EDAS at
https://edas.info/newPaper.php?c=26894

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WORKSHOPS and INDUSTRY TRACK
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DEADLINES
Full manuscript due: March 22, 2020
Acceptance notification: April 13, 2020
Camera-ready deadline: April 30, 2020

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WORKSHOPS: http://www.smart-comp.org/list-of-workshops.html
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IEEE SMARTCOMP 2020 is organising 5 high-quality workshops covering distinct areas and hot topics
in the area of Smart Computing. Accepted papers will be published in the IEEE Explore Digital Library as
part of the overall conference proceedings.


The list of workshops and industry track are below. Please consider submitting your work to the
most appropriate venues.

- BITS: Fourth IEEE Workshop on Big Data and IoT Security in Smart Computing https://www.yama.info.waseda.ac.jp/bits2020/
- SSC: Sixth IEEE International Workshop on Sensors and Smart Cities http://ssc2020.unime.it/
- SCIRS : First IEEE International Workshop on Smart Computing for Industrial and Real-World Systems
- SMARTSYS: Fifth IEEE Workshop on Smart Service Systems http://www.iet.unipi.it/smartsys2020/
- EdgeDL: Third IEEE International Workshop on Deep Learning on Edge for Smart Health and Wellbeing Applications https://sites.google.com/view/ieee-edgedl-2020/

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INDUSTRY TRACK: http://www.smart-comp.org/call-for-papers-industry-track.html
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The 6th IEEE International Conference on Smart Computing (SMARTCOMP 2020) draws upon many industrial applications such as transportation, energy,
environmental protection, resource management, healthcare, security, banking, entertainment, and social media. In addition to the research track,
this year SMARTCOMP will have a dedicated Industry Track. Accepted papers will be published as part of a separate section of the main conference proceedings
that highlights the Industry relevance of the submission. An important criterion for papers to be submitted to the Industry Track is clear industrial association,
either in the form of extensive evaluation of research results in industrial use cases or active participation of industry representatives as co-authors.
The industry track will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research
questions, approaches, and directions, with an industry focus.

Topics of interest include, but are not limited to:

- Smart Cyber-Physical Environments and Energy / Water / Agriculture / Transportation / Healthcare / Banking Infrastructure
- Security, Privacy, and Economics in Smart Environments
- Smart and Connected Communities across Cities
- Smart Computing Technologies
- Future Smart Computing Paradigms
- Smart Human Environments, Health, Entertainment, and Social Activities
- Smart Energy Management and Analytics
- Artificial Intelligence and Machine Learning for Smart Computing

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PhD Forum
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DEADLINES
Full manuscript due: April 16, 2020
Acceptance notification: April 23, 2020
Camera-ready deadline: April 30, 2020

http://www.smart-comp.org/call-for-phd-forum.html
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The Ph.D. Forum at SMARTCOMP 2020 provides an opportunity for Ph.D. students to present their work in progress to the scientific community and obtain individual feedback from leading researchers in the field. This forum is intended to provide doctoral students with a platform to interact with established researchers from both academia and industry and get useful guidance on the broader impacts of their research.

The Forum will be structured as a poster presentation session by the students, followed by collective discussions. The student presentations will be interleaved with speeches by leading researchers, who will provide their own perspectives on current and future research in the field, as well as on how to best pursue a Ph.D. in this context.

Current Ph.D. students at any stage of their career are encouraged to submit a 2-page extended abstract about their research to be considered for the Ph.D. Forum. The student should be the sole author, although contributions of the advisor and others should be acknowledged.

Submissions will be reviewed by the Ph.D. Forum program committee to ensure quality, relevance, and potential benefit from attendance to the Forum. There will be no separate registration fee for the Forum. Participating students will only need to register to the main SMARTCOMP conference. Authors of accepted submissions are expected to participate in person to the Forum. The proceedings of the Forum will be included in the proceedings of the main conference.

Authors are requested to submit manuscripts in standard IEEE proceedings format in PDF. All submissions must be typeset in double-column IEEE format using 10pt fonts on US letter paper, with all fonts embedded. Submitted abstracts must include the contact information of the authors. Please make sure you use the latest version of the templates to prepare your submissions. IEEE provides corresponding formatting templates at IEEE conference template.

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WiP and Demo
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DEADLINES
Full manuscript due: April 8, 2020
Acceptance notification: April 22, 2020
Camera-ready deadline: April 30, 2020

http://www.smart-comp.org/call-for-wipdemos.html
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The 6th IEEE International Conference on Smart Computing (SMARTCOMP 2020) draws upon many application disciplines such as transportation, energy, environmental protection, resource management, healthcare, security, banking, entertainment, and social media. In addition to full-length technical papers, SMARTCOMP welcomes Work in Progress (WIP) papers and technical demonstrations (Demos) showing innovative and original research in the areas of smart computing. Submissions from both industry and academia are strongly encouraged.

WIP papers are expected to report on early or ongoing research activities, while Demo papers are expected to present innovative applications and tools.

The WIP and Demo sessions will provide a forum to discuss novel ideas and emerging results, presenting innovative applications and tools, and bring about novel research questions, approaches, and directions.

Submission Guidelines

- WIP and Demo papers should be no more than 3 pages in length, including figures, tables, and references
- WIP papers are expected to present early or ongoing research activities. Novel approaches and preliminary results are especially appreciated
- Demo papers should explicitly state what will be demonstrated to the audience, and how the attendees will be able to interact, enjoy, and experiment
- Submitted WIP and Demo papers will be subject to peer reviews by Technical Program Committee members and other experts in the field. All accepted papers will be presented as posters, published in the conference proceedings, and submitted to the IEEE Xplore Digital Library. At least one author of each accepted paper must register and attend the conference to present the work
- Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format in PDF. Paper submissions should be formatted according to the IEEE conference template. Due to the short interval between the notification of acceptance and the camera-ready deadline, we strongly encourage authors to follow the camera-ready formatting guidelines as close as possible even for the initial abstract submission.




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